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DIGITAL-LOGIC AG MSB900/L Detailed Technical Manual V1.0
16
Operating Environment Specification
Relative humidity 5-90%, non-condensing
Vibration 5-2000Hz, 0.1G
Shock 1G
Temperature MSB900*:
Operating: Standard version: -25°C to +70°C
Extended version: -40°C to +85°C
Storage: -55°C to +85°C
* = with passive cooler
MSB900L**:
Operating: Standard version: 0°C to +60°C
Storage: -55°C to +85°C
** = without passive cooler
EMI/EMC (IEC1131-2 refer MIL
461/462)
Specification
ESD Electro Static Discharge IEC 801-2, EN55101-2, VDE 0843/0847 Part 2
Metallic protection needed
Separate ground layer included
15kV single peak
REF Radiated Electromagnetic Field IEC 801-3, VDE 0843 Part 3, IEC770 6.2.9. (not tested)
EFT Electric Fast Transient (Burst) IEC 801-4, EN50082-1, VDE 0843 Part 4
250V - 4kV, 50 ohms, Ts=5ns
Grade 2: 1kV Supply, 500 I/O, 5kHz
SIR Surge Immunity Requirements IEC 801-5, IEEE587, VDE 0843 Part 5
Supply: 2kV, 6 pulse/minute
I/O: 500V, 2 pulse/minute
FD, CRT: none
High-frequency Radiation EN55022
Compatibility Specification
MSB900/L Mechanically compatible to 3.5inch industrial embedded com-
puter boards
All information is subject to change without notice.
2.5. Examples of Ordering Codes
802220 MSB900 with LX900 CPU, 0MB-RAM, Battery, PCI/104 and Video input
802221 MSB900L with LX900 CPU, 0MB RAM, …
802205 MSB800CON COM1, LPT1 Expansion board.
These are only examples; for current ordering codes, please see the current price list.
2.6. Related Application Notes
Application Notes are available at http://www.digitallogic.com
support, or on any DIGITAL-LOGIC
Application CD.
# Description