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4.
Remove the fan/heat sink assembly (3).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board each time the fan/heat sink assembly is removed:
●
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
Thermal pads are used on the graphics subsystem chip (3) and the heat sink section (4) that
services it
●
Thermal pads are used on the system board capacitors (5) and the heat sink section (6) that
services them
Replacement thermal material is included with all fan/heat sink assembly, system board, and processor
spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
ENWW
Component replacement procedures
65