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Application Note
(Includes Differences for 970FX to 970MP)
IBM PowerPC
®
970MP RISC Microprocessor Preliminary
8. Package
Page 22 of 25
AppNote_970FX-MP_Differences_Body.fm.1.0
November 15, 2006
8.3 PowerPC 970MP Microprocessor Package Dimensions
IBM offers the 970MP in a ceramic ball grid array, CBGA, package which supports 575 balls. The 970MP is
offered in a lead reduced package with SnAgCu (SAC) balls. The following figures contain views of the
970MP package.
Figure 8-1 shows the side and top views of the Pb-reduced package including the height from the top of the
die to the bottom of the solder balls. Figure 8-2 shows a bottom view of the PowerPC 970MP package.
Table 8-4. Deleted 970FX Pins - not found on 970MP
970FX Pin 970FX Function
PROCID2 Least significant bit in the 3 bit processor ID, automatically set on PowerPC 970MP
THERM_INT_B
Dedicated thermal interrupt signal, removed due to lack of use
TRIGGERIN Initiate trace collection from outside, removed due to lack of use
PSYNC_OUT Used to check phase alignment while debugging, removed due to lack of use
SPARE_GND Unneeded Spare