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Application Note
(Includes Differences for 970FX to 970MP)
Preliminary IBM PowerPC
®
970MP RISC Microprocessor
AppNote_970FX-MP_Differences_Body.fm.1.0
November 15, 2006
8. Package
Page 23 of 25
Figure 8-1. PowerPC 970MP Mechanical Package (Side and Top View)
Legend
DATUM A is the center plane of feature labeled DATUM A.
DATUM B is the center plane of feature labeled DATUM B.
3 Unless otherwise specified part is symmetrical about centerlines defined by DATUMs A and B.
4
Where not otherwise defined, centerlines indicated are to be interpreted as a datum frame work, established by DATUMS
D, A, and B respectively.
This line defines the approximate boundary configuration of encapsulant as dispensed. For underfill requirements see IBM
Engineering Specification 71X8781 Module Encapsulation Specification.
9
The chip’s assembled height (which include silicon thickness and melted C4) for 300mm wafers is: 0.829mm - 0.908mm.
The 300mm silicon thickness is 0.785mm +/- 0.020mm.
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Top View
Side View