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OEM FUNCTIONAL SPECIFICATION ULTRASTAR XP (DFHC) SSA MODELS 1.12/2.25 GB - 1.0" HIGH
Table 15. Maximum and Reliability Operating Temperature Limits
Maximum Reliability
Disk Enclosure Top 158˚F (70˚C) 131˚F (55˚C)
Disk Enclosure Bottom 158˚F (70˚C) 131˚F (55˚C)
PRDF Prime Module 203˚F (95˚C) 176˚F (80˚C)
WD 61C40 Module 185˚F (85˚C) 167˚F (75˚c)
SIC Module 203˚F (95˚C) 176˚F (80˚C)
Microprocessor Module 194˚F (90˚C) 167˚F (75˚C)
VCM FET 194˚F (90˚C) 167˚F (75˚C)
DC/DC Converter (CxB only) 185˚F (85˚C) 167˚F (75˚C)
SMP FET 194˚F (90˚C) 167˚F (75˚C)
Note 1: Module temperature measurements should be taken from the top surface of the module.
Note 2: If copper tape is used to attach temperature sensors, it should be no larger than 6 square milli-
meters.
notes: 1) dimensions are in millimeters.
Figure 22. Temperature Measurement Points for All Models (top view of DE)
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