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Intel Q965 Express Chipset—Development Kit Hardware Features
Intel
®
Q965 Express Chipset
DM October 2007
13 Order Number: 315664-002US
2.3 Board Layout
Figure 1 shows the location of the major components, headers and jumpers.
Peripheral
Interfaces
Six SATA 1.5/3.0 Gb/s ports.
Ten Universal Serial Bus (USB) 2.0 ports – Three front panel headers for support of six
front panel ports and four back panel ports
Three 1394a PCI controller – 2 front headers for support of two ports and one back panel
port (Disabled in this Development Kit)
PS/2-style keyboard and PS/2 mouse (6-pin mini-DIN) connectors
One VGA connector provides access to integrated graphics.
Six analog audio connectors (Line-in, Line-out, MIC-in, Surround L/R, Surround L/R Rear,
Center) and two digital audio connectors driven by Intel High Definition Audio.
One parallel port.
One diskette drive interface
LAN Support
Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel® 82566DM Gigabit
Ethernet Controller
BIOS
Support for Advanced configuration and power interface (ACPI), plug and play, and
SMBIOS.
AMI system BIOS.
Expansion
Capabilities
One PCI bus connectors
One PCI Express* x16 bus add-in card connector
Two PCI Express* x1 bus add-in card connectors
Additional
Features
Trusted Platform Module (TPM) 1.2 support
Manageability Engine (ME) support. ME Enabled LED (red-blink)
Intel
®
Active Management Technology (Intel
®
AMT) with System Defense support
Intel
®
Quiet System Technology (Intel
®
QST) support
Intel
®
Matrix Storage technology with RAID 0,1,5, 10 support
Piezo speaker for BIOS POST codes
PORT 80 Display
Thermal Diode header
BIOS configuration jumper
Clear CMOS header
Force On header
XDP-SSA connector
Internal I/O headers
•2x5 Front Panel I/O header
• 2x7 Front Panel audio header
• 1x2 Chassis intrusion header
• 3 four-wire fan headers
•2x5 Serial port header
• 2x8 High Definition audio header
• 20-pin LPC header
Table 3. Development Kit Features Summary (Sheet 2 of 2)
Form Factor 4 Layer μBTX (10.5 inches x 10.4 inches)