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Intel Q965 Express Chipset—
Intel
®
Q965 Express Chipset
DM October 2007
3 315664-002US
Contents
1.0 About This Manual .................................................................................................... 7
1.1 Content Overview ............................................................................................... 7
1.2 Text Conventions................................................................................................ 7
1.3 Glossary of Terms and Acronyms .......................................................................... 8
1.4 Support Options ................................................................................................11
1.4.1 Electronic Support Systems......................................................................11
1.4.2 Additional Technical Support ....................................................................11
1.5 Product Literature..............................................................................................11
2.0 Development Kit Hardware Features ........................................................................12
2.1 Overview..........................................................................................................12
2.2 Intel
®
Q965
®
Express Chipset Development Kit Features Summary .........................12
2.3 Board Layout ....................................................................................................13
2.3.1 Core Components ...................................................................................14
2.3.2 Jumper Settings and Descriptions .............................................................15
2.3.3 LED Descriptions ....................................................................................15
2.3.4 Header and Connector Descriptions...........................................................15
2.3.5 Back Panel Connectors ............................................................................16
2.3.6 PCI Express* x16 / MEC Slot....................................................................17
2.3.7 PCI Express* x1 .....................................................................................20
2.3.8 Front Panel Header (Power up & Reset) .....................................................21
2.3.9 Front Panel USB Header...........................................................................21
2.3.10 Front Audio Header.................................................................................22
2.3.11 High Definition Audio Header....................................................................22
2.3.12 BTX Power Connectors ............................................................................23
2.3.13 SATA Pinout...........................................................................................24
2.3.14 Fan Connectors ......................................................................................24
2.4 Thermal Considerations ......................................................................................24
3.0 Development Kit Software and BIOS Features .........................................................26
3.1 Software Key Features .......................................................................................26
3.2 BIOS Features...................................................................................................26
3.2.1 BIOS Overview.......................................................................................26
3.2.2 Resource Configuration............................................................................27
3.2.3 System Management BIOS (SMBIOS)........................................................27
3.2.4 Legacy USB Support ...............................................................................28
3.2.5 Boot Options..........................................................................................28
3.2.6 BIOS Security Features ...........................................................................29
3.3 Graphics Drivers................................................................................................29
3.4 Intel
®
Active Management Technology .................................................................30
3.5 Intel
®
Quiet System Technology ..........................................................................31
4.0 Setting Up & Configuring the Development Kit.........................................................32
4.1 Overview..........................................................................................................32
4.2 Additional Hardware & Software Required .............................................................33
4.3 Setting Up the Evaluation Board ..........................................................................33
4.3.1 Memory Configurations............................................................................40
4.4 Audio Subsystem Configurations..........................................................................43
4.4.1 Eight-Channel (7.1) Audio Subsystem .......................................................43
4.5 LAN Subsystem Configurations ............................................................................44
4.5.1 Gigabit LAN Subsystem ...........................................................................44
4.5.2 RJ-45 LAN Connector with Integrated LEDs ................................................45
4.6 Software Kit Installation .....................................................................................45