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High Availability Software for the Intel
®
NetStructure
TM
ZT 4901 Technical Product Specification 3
Contents
Contents
1 Document Organization................................................................................................................9
2 Introduction..................................................................................................................................11
2.1 Terminology ........................................................................................................................11
2.2 High Availability Hardware Approach .................................................................................14
2.2.1 Processor Boards ..................................................................................................15
2.2.2 Bridge Mezzanine ..................................................................................................16
2.2.3 Backplane ..............................................................................................................17
2.3 High-Availability Software Approach...................................................................................18
2.3.1 Host Application.....................................................................................................18
2.3.2 System Management.............................................................................................19
2.3.3 Backplane Device Drivers......................................................................................20
3 Host Application Software..........................................................................................................21
3.1 Goals of the Host Application .............................................................................................21
3.1.1 Serviceability..........................................................................................................21
3.1.2 Portability ...............................................................................................................21
3.1.3 Redundancy...........................................................................................................21
3.2 Division of Labor .................................................................................................................22
3.3 Development Issues ...........................................................................................................23
3.3.1 Redundancy...........................................................................................................23
3.3.2 Graceful Switchover...............................................................................................24
3.3.3 Hardened Applications...........................................................................................24
3.3.4 Code Modularity.....................................................................................................24
4 System Management...................................................................................................................25
4.1 Redundant Host API ...........................................................................................................25
4.1.1 IPMI API.................................................................................................................25
4.1.2 Hot Swap API ........................................................................................................26
4.1.2.1 Slot Control API .....................................................................................26
4.2 Baseboard Management Controller Firmware Enhancements...........................................26
4.2.1 Fault Configuration ................................................................................................26
4.2.2 Isolation Strategies ................................................................................................27
4.2.3 IPMI RH Channel Commands................................................................................28
4.2.3.1 RH Channel Enabled .............................................................................28
4.2.3.2 RH Channel Get RH BMC Address .......................................................28
5 High Availability CompactPCI Device Drivers ..........................................................................31
5.1 Device Driver Design ..........................................................................................................31
5.1.1 Device Driver States ..............................................................................................32
5.1.1.1 Initialization ............................................................................................32
5.1.1.2 Quiesced................................................................................................32
5.1.1.3 Activation ...............................................................................................32
5.1.2 Adding High-Availability Functionality....................................................................33
5.1.2.1 Add Device.............................................................................................34
5.1.2.2 Resume Operations...............................................................................34
5.1.2.3 Suspend Operations ..............................................................................35