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Chapter 2. Preparation
This chapter describes the package components, the system configuration and the preparation for using this product for the
first time.
2.1 Package Components................................................................................................................... 22
2.2 Other Tool Products Required for Development......................................................................... 22
2.3 Name of Each Part ....................................................................................................................... 23
(1) System Configuration ........................................................................................................... 23
(2) Inside of the Emulation Pod.................................................................................................. 24
2.4 When Using This Product for the First Time .............................................................................. 25
(1) Making the MCU File ........................................................................................................... 25
(2) Setting the Work Area .......................................................................................................... 25
(3) Downloading Firmware ........................................................................................................26
(4) Self-check ............................................................................................................................. 26