Samsung M471B1G73AH0 Computer Hardware User Manual


 
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Unbuffered SODIMM datasheet DDR3 SDRAM
Rev. 1.0
1. DDR3 Unbuffered SODIMM Ordering Information
NOTE :
1. "##" - F8/H9
2. F8 - 1066Mbps 7-7-7 & H9 - 1333Mbps 9-9-9
- DDR3-1333(9-9-9) is backward compatible to DDR3-1066(7-7-7)
2. Key Features
JEDEC standard 1.5V ± 0.075V Power Supply
•V
DDQ
= 1.5V ± 0.075V
400 MHz f
CK
for 800Mb/sec/pin, 533MHz f
CK
for 1066Mb/sec/pin, 667MHz f
CK
for 1333Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 5,6,7,8,9
Programmable Additive Latency(Posted CAS) : 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 5(DDR3-800), 6(DDR3-1066) and 7(DDR3-1333)
Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or
write [either On the fly using A12 or MRS]
Bi-directional Differential Data Strobe
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower then T
CASE
85°C, 3.9us at 85°C < T
CASE
95°C
Asynchronous Reset
3. Address Configuration
Part Number
2
Density Organization Component Composition
Number of
Rank
Height
M471B1G73AH0-CF8/H9 8GB 1Gx64 512Mx8(K4B4G0846A-HC##)*16 2 30mm
Speed
DDR3-800 DDR3-1066 DDR3-1333
Unit
6-6-6 7-7-7 9-9-9
tCK(min) 2.5 1.875 1.5 ns
CAS Latency 6 79tCK
tRCD(min) 15 13.125 13.5 ns
tRP(min) 15 13.125 13.5 ns
tRAS(min) 37.5 37.5 36 ns
tRC(min) 52.5 50.625 49.5 ns
Organization Row Address Column Address Bank Address Auto Precharge
512Mx8(4Gb) based Module A0-A15 A0-A9 BA0-BA2 A10/AP