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Removal and replacement procedures
Maintenance and Service Guide 4–47
✎
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time
the heat sink is removed:
■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it.
■ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it.
Replacement thermal material is included with all system board, heat sink, and processor spare part kits.
Reverse this procedure to install the heat sink.