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GEK-106465A CIO Remote CAN Digital I/O Module 13
3. HARDWARE
3.1. MODULE DESCRIPTION
FIGURE 3-1 BLOCK DIAGRAM
F650 units incorporate the following modules:
Power supply
Input/Output module
Optionally, a second I/O module can be added.
A relay connected to the low voltage side of the power supply monitors this voltage. The three contact terminals,
normally open, common, and normally closed, are available at the external connector terminals. This relay monitors
only the power supply integrity.
This is a “fly-back” type power supply, providing high efficiency, stability and reliability thanks to the maturity of this
technology. There are two available ranges, Hi and Low, in order to optimize efficiency and general performance,
including the capability to tolerate auxiliary voltage interruptions (dips).
Oversized components highly resistant to temperature are used. For example, all capacitors are specified to stand up
to 105ºC, transformer components are specially designed to stand up to 180ºC, the used MOSFET transistor is of
very low resistance, supports high voltage and is refrigerated by an oversized heat sink. This allows supporting
extremely high temperatures, and prolonged overloads such as the ones occurring at batteries in deep charge mode
(much higher than the maximum voltage shown in the Technical Characteristics section).
High capacity capacitors are also used, providing high tolerance to prolonged dips, 100ms, even in the most
unfavorable consumption conditions. This allows the relay to continue with normal operation without undesired resets,
which would cause a long time of protection unavailability
S
S
e
e
r
r
i
i
a
a
l
l
C
C
A
A
N
N
B
B
U
U
S
S
DIGITAL
I/O
Power Supply
DIGITAL
I/O
Optional