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3. Remove the heat sink (3) by lifting it straight up.
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
system board components, it may be necessary to move the heat sink from side to side to detach the
assembly.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink (1) and
(3), the processor (2), and graphics subsystem component (4) on the system board each time the heat
sink is removed. Thermal material is included with all system board, heat sink, and processor spare part
kits, and is also available in the Thermal Material Kit, spare part number 445853-001.
Reverse this procedure to install the heat sink.
74 Chapter 4 Removal and replacement procedures