HP (Hewlett-Packard) DC5750 Personal Computer User Manual


 
Service Reference Guide, dc5750 437963-001 7–31
Removal and Replacement Procedures— Small Form Factor (SFF) Chassis
7.18 Sys t em B o a rd
1. Prepare the computer for disassembly (Section 7.1).
2. Remove the access panel (Section 7.3).
3. Remove all PCI and PCI Express expansion boards (Section 7.9).
4. Remove the fan shroud from the chassis (Section 7.11).
5. Remove the optical drive (Section 7.7.2).
6. Rotate the optical drive retainer to its upright position.
7. Remove all memory modules (Section 7.8).
8. Disconnect all data and power cables from the system board.
9. Remove the power supply (Section 7.10).
10. Remove the system board retaining screws 1, slide the board towards the front of the
chassis, then lift the board from the chassis 2.
To install the system board, reverse the removal procedure.
Ä
CAUTION: Before reinstalling the heatsink you must clean the top of the processor and the bottom of the
heatsink with an alcohol pad supplied in the spares kit. After the alcohol has evaporated, apply thermal
grease to the top of the processor from the syringe supplied in the spares kit.
When reinstalling the system board it is important to secure the system board and tray to the
chassis with the long retaining screw before performing any subsequent steps.
Ä
CAUTION: When reconnecting the cables it is important that they be positioned so they do not interfere
with the rotation of the drive cage or power supply.