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Setting Description If too low If too high
Input tension Tension is applied to the
substrate from the input spindle.
It needs to be constant over the
full width of the substrate, thus
substrate load is a critical
operation.
The substrate skews and may
become increasingly wrinkled in
the printing zone. Also, substrate
advance may be irregular,
resulting in horizontal banding.
The substrate may be
permanently deformed or
damaged. Substrate advance
problems may appear in extreme
cases.
Vacuum level The vacuum applied to the
substrate at the printing zone
helps to hold the substrate down
on the print platen, keeping the
distance to the printheads
constant.
The substrate may lift up off the
platen and touch the printheads.
This can smear the printed
image, cause a substrate jam or
even damage the printheads.
For sticky substrates, friction
could be too high and substrate
advance irregular, resulting in
horizontal banding or irregular
grainy patches.
Here are some more advanced settings, which you are not recommended to change, unless you have
problems that you cannot resolve any other way.
Substrate family Warm-up drying
temperature
offset
Warm-up curing
temperature
offset
Cool-down
drying
temperature
offset
Cool-down
curing
temperature
offset
Minimum drying
power
Self-adhesive vinyl 10 0 0 0 0.7
Banner 10 0 0 0 0.7
Film 5 0 0 0 0.7
Fabric 5 0 0 0 0.7
Mesh 10 0 0 0 0.7
Paper-Aqueous 5 0 0 0 0
Paper-Solvent 10 0 0 0 0.7
HP Photorealistic 10 0 0 0 0
The various settings mentioned above are described below.
Setting Description If too low If too high
Warm-up drying
temperature offset
The temperature that the
substrate in the print zone must
reach before printing starts.
Bleeding or coalescence may
appear in the first 200-300 mm of
the print.
A longer time to start printing is
required. Vertical banding or ink
smears may occur.
Warm-up curing
temperature offset
The temperature that the
substrate in the curing zone must
reach before printing starts.
The beginning of the print is not
fully dry, or looks oily.
Substrate degradation (bubbles,
adhesive detachment) at the
beginning of the print.
Cool-down drying
temperature offset
The safe temperature at which
the substrate can be under the
drying module without being
damaged. At the end of a job, the
substrate is not stopped until this
temperature is reached.
A long time is needed to finish the
print.
The substrate at the beginning of
the next print may be damaged,
because it has stopped moving
under too high a temperature.
This case is uncommon.
ENWW Add a new substrate type 35
Handle the substrate