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Thermal Metrology
28 Thermal and Mechanical Design Guidelines
For reference thermal solution of Intel Celeron processor 200 sequence on Intel
Desktop Board D201GLY2, the junction-to-local ambient thermal characterization
parameter of the processor, Ψ
JA
, is comprised of Ψ
JS
, the thermal interface material
thermal characterization parameter, Ψ
HS_BASE
the thermal characterization parameter
of the heatsink base from bottom center of heatsink base to top center of heatsink
base surface, and of Ψ
S-TOP-A
, the sink-to-local ambient thermal characterization
parameter:
Equation 3 Ψ
JA
= Ψ
JS
+ Ψ
HS_BASE
+ Ψ
S-TOP-A
Where:
Ψ
JS
= Thermal characterization parameter of the thermal interface material
(°C/W)
Ψ
HS_BASE
= Thermal characterization parameter of the heatsink base (°C/W)
Ψ
S-TOP-A
= Thermal characterization parameter from heatsink top to local
ambient (°C/W)
Ψ
JS
is strongly dependent on the thermal conductivity, thickness and performance
degradation across time of the TIM between the heatsink and processor die.
Ψ
HS_BASE
is a measure of the thermal characterization parameter of the heatsink base.
It is dependent on the heatsink base material, thermal conductivity, thickness and
geometry.
Ψ
S-TOP-A
is a measure of the thermal characterization parameter from the top center
point of the heatsink base to the local ambient air. Ψ
S-TOP-A
is dependent on the
heatsink material, thermal conductivity, and geometry. It is also strongly dependent
on the air flow through the fins of the heatsink.
Equation 4 (Ψ
JA
−
Ψ
JS
−
Ψ
HS_BASE
) × P
D
+ T
A
= T
S-TOP-MAX
With a given processor junction-to-local ambient requirement (Ψ
JA
) and TIM
performance (Ψ
JS
) and processor power consumption (P
D
), the processor’s heatsink
requirement (T
S-TOP-MAX
)
could be defined by Equation 4.