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Introduction
Thermal and Mechanical Design Guidelines 9
1.2 Reference Documents
Material and concepts available in the following documents may be beneficial when
reading this document.
Document Document
No./Location
Intel
®
Celeron
®
Processor 200 Sequence Datasheet http://developer.intel
.com/design/processo
r/datashts/318546.ht
m
Power Supply Design Guide for Desktop Platform Form Factors (Rev
1.1)
http://www.formfacto
rs.org/
ATX Thermal Design Suggestions http://www.formfactors.
org/
microATX Thermal Design Suggestions http://www.formfactors.
org/
Balanced Technology Extended (BTX) System Design Guide http://www.formfactors.
org/
Thermally Advantaged Chassis version 1.1 http://www.intel.com/g
o/chassis/
1.3 Definition of Terms
Term Description
T
A
The measured ambient temperature locally surrounding the processor. The
ambient temperature should be measured just upstream of a passive heatsink or
at the fan inlet for an active heatsink.
T
J
Processor junction temperature.
T
S-TOP
Heatsink temperature measured at vicinity to center on the top surface of
heatsink base.
Ψ
JA
Junction-to-ambient thermal characterization parameter (psi). A measure of
thermal solution performance using total package power. Defined as
(T
J
– T
A
) / Total Package Power.
Note: Heat source must be specified for Ψ measurements.
Ψ
JS
Junction-to-sink thermal characterization parameter. A measure of thermal
interface material performance using total package power. Defined as
(T
J
– T
S
) / Total Package Power.
Note: Heat source must be specified for Ψ measurements.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink
thermal performance using total package power. Defined as