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Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families 251
Datasheet Volume One
Boxed Processor Specifications
Figure 10-9. Boxed Processor Heat Sink Volumetric (2 of 2)
13
4
5678
B
C
D
A
123
4
5678
B
C
D
A
A
A
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
38.00#0.50
1.496#0.019[]
38.00#0.50
1.496#0.019[]
80.00
[3.150]
80.00
[3.150]
1.00
0.039[]
ORDINATE BASELINE0.00
0.000[]
BASE THICKNESS 9
4.50#0.13
0.177#0.005[]
5.50
0.217[]
9
7.95
+0.13
0
0.313
+0.005
-0.000
[]
9
5.40
+0.13
0
0.213
+0.005
-0.000
[]
10.450
[0.4114]
E95132 2 B
DWG. NO SHT. REV
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
SHEET 2 OF 2DO NOT SCALE DRAWINGSCALE: 1.500
PTMI
BE95132D
REVDRAWING NUMBERSIZEDEPARTMENT
FLATNESS ZONE,
SEE NOTE 7
BOTTOM VIEW
9
9
AIRFLOW DIRECTION
AIRFLOW DIRECTION
TOP VIEW
SECTION A-A
SEE DETAIL B
SEE DETAIL C
DETAIL B
SCALE 10.000
0.5 x 45$
ALL AROUND
DETAIL C
SCALE 6.000
3.0 [0.118] X 45$ TYP
SEE NOTE 8
0.077 [0.0030]
0.1 [0.00] A B C
The drawing contains intel corporation information. Its contents may not be reproduced,
displayed, or modified without the prior written consent of Intel Corporation.