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1999 Oct 12 25
Philips Semiconductors Product specification
IC card interface TDA8002C
0.2
UNIT
A
max.
A
1
A
2
A
3
b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
1.60
0.15
0.05
1.5
1.3
0.25
0.27
0.17
0.18
0.12
5.1
4.9
0.5
7.15
6.85
1.0
0.95
0.55
7
0
o
o
0.12 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT401-1
95-12-19
97-08-04
D
(1) (1)(1)
5.1
4.9
H
D
7.15
6.85
E
Z
0.95
0.55
D
b
p
e
E
B
8
D
H
b
p
E
H
v M
B
D
Z
D
A
Z
E
e
v M
A
X
1
32
25
24
17
16
9
θ
A
1
A
L
p
detail X
L
(A )
3
A
2
y
w M
w M
0 2.5 5 mm
scale
LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm
SOT401-1
c
pin 1 index