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FC0151103-00 E B-1
Appendix B
Specifications
Table B-1. QLA22xx Board Operating Environment
Environment Minimum Maximum
Operating temperature 0°C/32°F 55°C/131°F
Storage temperature -20°C/-4°F 70°C/158°F
Relative humidity (noncondensing) 10% 90%
Storage humidity (noncondensing) 5% 95%
Table B-2. QLA22xx Board Specifications
Type Specification
Host bus Conforms to PCI Local Bus Specification, revision 2.2
PCI signaling
environment
3.3 V and 5.0 V busses supported
PCI transfer
rate
132 Mbytes/sec maximum burst rate for 32-bit PCI operation at 33 MHz
264 Mbytes/sec maximum burst rate for 32-bit PCI operation at 66 MHz
264 Mbytes/sec maximum burst rate for 64-bit PCI operation at 33 MHz
528 Mbytes/sec maximum burst rate for 64-bit PCI operation at 66 MHz
Fibre Channel
specifications
Bus type: copper media, twisted pair (QLA2200/2200L)
fibre optic media (QLA2200F/2202F/2204F/2212F)
GBIC (QLA2200G)
Bus transfer rate: 100 Mbytes/sec maximum at half duplex
200 Mbytes/sec maximum at full duplex
Interface chip: ISP2200 or ISP2200A
Central
processing
unit (CPU)
Single-chip design that includes a RISC processor, Fibre Channel
protocol manager, PCI DMA controller, and 1-gigabit transceivers
Host data
transfer
64-bit, 33-MHz bus master DMA data transfers to 264 Mbytes/sec
64-bit, 66-MHz bus master DMA data transfers to 528 Mbytes/sec
RAM 128K bytes of SRAM
BIOS ROM 128K bytes of flash ROM in two 64K-byte, software selectable banks. The
flash is field programmable.
NVRAM 256 bytes, field programmable
Onboard DMA Three independent DMA channels: two data and one command.
Integrated 4K-byte frame buffer FIFO for each data channel.