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1-41-4
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Chapter 1: Product introductionChapter 1: Product introduction
Chapter 1: Product introductionChapter 1: Product introduction
Chapter 1: Product introduction
S/PDIF digital sound ready S/PDIF digital sound ready
S/PDIF digital sound ready S/PDIF digital sound ready
S/PDIF digital sound ready
The motherboard supports the S/PDIF In/Out function through the S/PDIF
interfaces on the rear panel and at midboard. The S/PDIF technology turns
your computer into a high-end entertainment system with digital connectivity
to powerful audio and speaker systems. See page 2-23 for details.
USB 2.0 technology USB 2.0 technology
USB 2.0 technology USB 2.0 technology
USB 2.0 technology
The motherboard implements the Universal Serial Bus (USB) 2.0
specification, dramatically increasing the connection speed from the
12 Mbps bandwidth on USB 1.1 to a fast 480 Mbps on USB 2.0. USB 2.0 is
backward compatible with USB 1.1. See page 2-23 and 2-29 for details.
Temperature, fan, and voltage monitoringTemperature, fan, and voltage monitoring
Temperature, fan, and voltage monitoringTemperature, fan, and voltage monitoring
Temperature, fan, and voltage monitoring
The CPU temperature is monitored by the ASIC (integrated in the Winbond
Super I/O) to prevent overheating and damage. The system fan rotations
per minute (RPM) is monitored for timely failure detection. The ASIC
monitors the voltage levels to ensure stable supply of current for critical
components.