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Enfora Enabler II-G Assisted GPS
Modem Integration Guide
Figure 5 Enabler II-G Package Dimensions (with integrated SIM carrier)
• Use 46.0 X 30.2 X 3.1 as overall module dimension
• Mated 60-pin I/O connector stack height is 2.0 MM
• If mounting screw is used, a nylon washer is recommended at board interface. A
maximum diameter of 4.00 should be used for all fastening hardware.
• Antenna direct connect solder pad is 1.02 mm wide X 2.54 mm high.
• Antenna ground pads are 2.03 mm wide X 2.54 mm high.
MLG0208PB001 21 Version1.01 – 10/3/2006