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RX − 8564 LC
Page − 9
ETM12E-01
11. Application notes
1) Notes on handling
This module uses a C-MOS IC to realize low power consumption. Carefully note the following cautions when handling.
(1) Static electricity
While this module has built-in circuitry designed to protect it against electrostatic discharge, the chip could still be damaged by a large
discharge of static electricity. Containers used for packing and transport should be constructed of conductive materials. In addition,
only soldering irons, measurement circuits, and other such devices which do not leak high voltage should be used with this module,
which should also be grounded when such devices are being used.
(2) Noise
If a signal with excessive external noise is applied to the power supply or input pins, the device may malfunction or "latch up." In order
to ensure stable operation, connect a filter capacitor (preferably ceramic) of greater that 0.1
µ
F as close as possible to the power
supply pins (between VDD and GNDs). Also, avoid placing any device that generates high level of electronic noise near this module.
* Do not connect signal lines to the shaded area in the figure shown in Fig. 1 and, if possible, embed this area in a GND land.
(3) Voltage levels of input pins
When the input pins are at the mid-level, this will cause increased current consumption and a reduced noise margin, and can impair
the functioning of the device. Therefore, try as much as possible to apply the voltage level close to VDD or GND.
(4) Handling of unused pins
Since the input impedance of the input pins is extremely high, operating the device with these pins in the open circuit state can lead
to unstable voltage level and malfunctions due to noise. Therefore, pull-up or pull-down resistors should be provided for all unused
input pins.
2) Notes on packaging
(1) Soldering heat resistance.
If the temperature within the package exceeds +260
°
C, the characteristics of the crystal oscillator will be degraded and it may be
damaged. The reflow conditions within our reflow profile is recommended. Therefore, always check the mounting temperature and
time before mounting this device. Also, check again if the mounting conditions are later changed.
* See Fig. 2 profile for our evaluation of Soldering heat resistance for reference.
(2) Packaging equipment
This product uses a molded package whose back contains glass.
Therefore, it is possible for shocks during packaging to cause product breakage, depending on the packaging machinery and
conditions.
Please be sure to check that the load placed on products during packaging is as low as possible (low speeds during loading onto the
substrate, low chuck forces, etc.) before using packaging equipment.
Carry out the same checks when changing packaging conditions.
The presence of foreign objects between this product and the packaging substrate may result in product breakage.
Guard against introduction of foreign objects during packaging.
Also, carry out measures to eliminate static electricity during packaging of and operations with this product.
(3) Ultrasonic cleaning
Depending on the usage conditions, there is a possibility that the crystal oscillator will be damaged by resonance during ultrasonic
cleaning. Since the conditions under which ultrasonic cleaning is carried out (the type of cleaner, power level, time, state of the inside
of the cleaning vessel, etc.) vary widely, this device is not warranted against damage during ultrasonic cleaning.
(4) Mounting orientation
This device can be damaged if it is mounted in the wrong orientation. Always confirm the orientation of the device before mounting.
(5) Leakage between pins
Leakage between pins may occur if the power is turned on while the device has condensation or dirt on it. Make sure the device is dry
and clean before supplying power to it.
(6) Use of adhesive after packaging product
This product uses a molded package whose back contains glass.
Please check that use of the adhesive does not cause problems before adopting any adhesive as a measure to reinforce the
packaging for your product.
Fig. 1 : Example GND Pattern
Fig. 2 : Reference profile for our evaluation of Soldering heat resistance.
RX − 8564 LC
( VSOJ − 12 pin )
∗ The shaded part ( )
indicates where a GND pattern
should be set without getting too
close to a signal line
+1
∼
+5
°
C/ s
100 s
Pre-heating area
−1 ∼ −5 °C / s
time [ s ]
Temperature [ °C ]
+170
°
C +220
°
C
+260 °C Max.
+1
∼
+5
°
C / s
35 s
Stable Melting area