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The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the fan/heat sink assembly is removed. Replacement thermal material is
included with the fan/heat sink assembly, processor, and system board spare part kits.
Replacement thermal material is also available in the Thermal Material Kit.
NOTE: The following illustration shows the replacement thermal material locations on a computer
model equipped with an AMD processor and a graphics subsystem with discrete memory.
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Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that
services it (only on computer models equipped with a graphics subsystem with discrete memory)
●
A thermal pad is used on the Northbridge chip (5) and the heat sink section (6) that services it
NOTE: The following illustration shows the replacement thermal material locations on a computer
model equipped with an Intel processor and a graphics subsystem with discrete memory.
●
Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
A thermal pad is used on the graphics subsystem chip (3) and the heat sink section (4) that
services it (only on computer models equipped with a graphics subsystem with discrete memory)
●
A thermal pad is used on the Northbridge chip (5) and the heat sink section (6) that services it
94 Chapter 4 Removal and replacement procedures