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©2002 Inova Computers GmbH Page 1-5Doc. PD00581013.004
ICP-PIII
Product Overview
CompactPCI
®
1
PCI/PCI Intel 21150 transparent bridge (Master) or Intel 21554 non-transpar-
ent PCI/PCI bridge for multiprocessing (Slave) operation with Basic
Hot-Swap support (PICMG 2.1 R1.0), Serialized interrupts and univer-
sal (3.3/5.0V) V I/O support
On-Board I/O Ī 10/100 MBit/s Ethernet (Intel 82559)
Ī optional 2nd independent Fast Ethernet
Ī Up to 2x 12Mbit/s USB
Ī Up to 2x 400Mbit/s FireWire interfaces
Rear I/O Standard to all CPU variants is option ‘C’ which provides 2nd FireWire
channel, 2nd USB channel, LPT1 (Floppy), EIDE and loudspeaker.
Other I/O configurations including customized are possible.
Mass Storage 1.44MByte 3.5” floppy drive and EIDE (flex cable/rear I/O) support-
ing 2 pairs (Master/Slave) hard-disks or CD ROMs
Front-Panels Optional 4TE front-panel extension provides:
COM1, COM2, keyboard, PS-2 mouse
Extended front-panel (4TE) provides:
COM2, LPT1
Connectors USB (USB), RJ45 (Ethernet), 6-pin FireWire (FireWire), 15-pin D-Sub
(PanelLink), 15-pin high-density D-Sub (VGA), 9-pin D-Sub
(GigaST
Ȣ
R)
CompactPCI PICMG 2.0 R3.0, 32-bit, 33MHz system slot interface with 7 Master
(DMA) support. Dual-slot operation
Mechanics 3U (100 x 160 x 21mm) 4 TE
3U (100 x 160 x 42mm) 8 TE
3U (100 x 160 x 63mm) 12 TE
Power Cons. 25W typ. PIII @ 850MHz (Lynx)
21W typ. PIII @ 700MHz (Lynx)
12W typ. Mobile PIII @ 500MHz (Lynx)
Software Windows® NT®, Windows® 2000, Windows® 9x, Linux,
Support VxWorks®, QNX®
Mass 220g (4TE)
Oper. Temp. 0°C to +60°C (Ambient)*
Storage Temp. -40°C to +85°C (400MHz Mobile [Lynx] only)
Extended Temp. -40 to +85°C (Seleted CPUs only)
Humidity 5% to 95% (non-condensing)
Warranty Three-year limited warranty
Conformance PICMG 2.0 R3.0
CE
*Note: Any CPU fitted with HD, FD or CD-ROM etc. has a max. operational temperature of 50 °C
CPUs without HD or PC inter faces ar e single-slot (4TE) for ‘pr ocessor speeds ≤ 700MHz.
Mobile processors are passively cooled - installation MUST have >0.3m/s air flow!