Filter
Top Products
Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families, 209
Datasheet Volume One of Two
Package Mechanical Specifications
9 Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FCLGA12) package that
interfaces with the baseboard via an LGA2011-0 socket. The package consists of a
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Figure 9-1 shows a sketch
of the processor package components and how they are assembled together. Refer to
the
Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2 Product Families Thermal /
Mechanical Design Guide for complete details on the LGA2011-0 socket.
The package components shown in Figure 9-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Note:
1. Socket and baseboard are included for reference and are not part of the processor package.
9.1 Package Size and SKUs
The processor is supported in two package sizes:
• Package A: 52.5 mm x 45 mm and
• Package B: 52.5 mm x 51 mm
Below is a table that shows the associated processor SKUs with the package sizes. For
details on processor SKU information, see Table 1-1, “HCC, MCC, and LCC SKU Table
Summary”
Figure 9-1. Processor Package Assembly Sketch
IHS
Substrate
System Board
Capacitors
TIM
LGA2011-0 Socket
Die