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Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families 5
Datasheet Volume One of Two
6.9 Processor Asynchronous Sideband and Miscellaneous Signals ................................ 122
6.10 Processor Power and Ground Supplies................................................................ 125
7 Electrical Specifications......................................................................................... 127
7.1 Processor Signaling ......................................................................................... 127
7.1.1 System Memory Interface Signal Groups ................................................. 127
7.1.2 PCI Express Signals.............................................................................. 127
7.1.3 DMI2/PCI Express Signals ..................................................................... 127
7.1.4 Intel® QuickPath Interconnect............................................................... 127
7.1.5 Platform Environmental Control Interface (PECI) ...................................... 128
7.1.6 System Reference Clocks (BCLK{0/1}_DP, BCLK{0/1}_DN)....................... 128
7.1.7 JTAG and Test Access Port (TAP) Signals ................................................. 129
7.1.8 Processor Sideband Signals ................................................................... 129
7.1.9 Power, Ground and Sense Signals........................................................... 129
7.1.10 Reserved or Unused Signals................................................................... 134
7.2 Signal Group Summary .................................................................................... 134
7.3 Power-On Configuration (POC) Options............................................................... 138
7.4 Fault Resilient Booting (FRB)............................................................................. 138
7.5 Mixing Processors............................................................................................ 139
7.6 Flexible Motherboard Guidelines (FMB)............................................................... 140
7.7 Absolute Maximum and Minimum Ratings ........................................................... 140
7.7.1 Storage Condition Specifications............................................................. 140
7.8 DC Specifications ............................................................................................ 141
7.8.1 Voltage and Current Specifications.......................................................... 141
7.8.2 Die Voltage Validation........................................................................... 146
7.8.3 Signal DC Specifications........................................................................ 147
7.9 Signal Quality ................................................................................................. 154
7.9.1 DDR3 Signal Quality Specifications ......................................................... 154
7.9.2 I/O Signal Quality Specifications............................................................. 154
7.9.3 Intel® QuickPath Interconnect Signal Quality Specifications....................... 154
7.9.4 Input Reference Clock Signal Quality Specifications................................... 154
7.9.5 Overshoot/Undershoot Tolerance............................................................ 155
8 Processor Land Listing........................................................................................... 159
8.1 Listing by Land Name ...................................................................................... 159
8.2 Listing by Land Number ................................................................................... 183
9 Package Mechanical Specifications ........................................................................ 209
9.1 Package Size and SKUs .................................................................................... 209
9.2 Package Mechanical Drawing (PMD) ................................................................... 210
9.3 Processor Component Keep-Out Zones............................................................... 215
9.4 Package Loading Specifications ......................................................................... 215
9.5 Package Handling Guidelines............................................................................. 215
9.6 Package Insertion Specifications........................................................................ 215
9.7 Processor Mass Specification............................................................................. 216
9.8 Processor Materials.......................................................................................... 216
9.9 Processor Markings.......................................................................................... 216
10 Boxed Processor Specifications ............................................................................. 217
10.1 Introduction ................................................................................................... 217
10.1.1 Available Boxed Thermal Solution Configurations...................................... 217
10.1.2 Intel Thermal Solution STS200C
(Passive/Active Combination Heat Sink Solution) ...................................... 217
10.1.3 Intel Thermal Solution STS200P and STS200PNRW
(Boxed 25.5 mm Tall Passive Heat Sink Solutions).................................... 218
10.2 Mechanical Specifications ................................................................................. 219
10.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones ........ 219
10.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (ILM-RS) ...... 228