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Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families 7
Datasheet Volume One of Two
2-42 Processor ID Construction Example...................................................................... 60
2-43 RdIAMSR() ....................................................................................................... 61
2-44 PCI Configuration Address .................................................................................. 63
2-45 RdPCIConfig()................................................................................................... 64
2-46 PCI Configuration Address for local accesses ......................................................... 65
2-47 RdPCIConfigLocal()............................................................................................ 65
2-48 WrPCIConfigLocal() ........................................................................................... 67
2-49 The Processor PECI Power-up Timeline() .............................................................. 69
2-50 Temperature Sensor Data Format........................................................................ 75
4-1 Idle Power Management Breakdown of the Processor Cores..................................... 89
4-2 Thread and Core C-State Entry and Exit ............................................................... 89
4-3 Package C-State Entry and Exit........................................................................... 93
5-1 TCase Temperature Thermal Profile ................................................................... 104
5-2 Digital Thermal Sensor DTS Thermal Profile ........................................................ 106
5-3 Embedded Case Temperature Thermal Profile...................................................... 108
5-4 Embedded DTS Thermal Profile ......................................................................... 109
5-5 Case Temperature (TCASE) Measurement Location .............................................. 110
5-6 Frequency and Voltage Ordering........................................................................ 112
7-1 Input Device Hysteresis ................................................................................... 128
7-2 VR Power-State Transitions............................................................................... 132
7-3 Processor VCC Static and Transient Tolerance Loadlines ....................................... 145
7-4 Load Current Versus Time ................................................................................ 146
7-5 VCC Overshoot Example Waveform.................................................................... 147
7-6 BCLK{0/1} Differential Clock Crosspoint Specification .......................................... 153
7-7 BCLK{0/1} Differential Clock Measurement Point for Ringback .............................. 153
7-8 BCLK{0/1} Single Ended Clock Measurement Points for Absolute Cross Point
and Swing...................................................................................................... 153
7-9 Maximum Acceptable Overshoot/Undershoot Waveform........................................ 157
9-1 Processor Package Assembly Sketch .................................................................. 209
9-2 Processor PMD Package A (52.5 x 45 mm) Sheet 1 of 2........................................ 211
9-3 Processor PMD Package A (52.5 x 45 mm) Sheet 2 of 2........................................ 212
9-4 Processor PMD Package B (52.5 x 51 mm) Sheet 1 of 2........................................ 213
9-5 Processor PMD Package B (52.5 x 51 mm) Sheet 2 of 2........................................ 214
9-6 Processor Top-Side Markings ........................................................................... 216
10-1 STS200C Passive/Active Combination Heat Sink (with Removable Fan)................... 218
10-2 STS200C Passive/Active Combination Heat Sink (with Fan Removed) ..................... 218
10-3 STS200P and STS200PNRW 25.5 mm Tall Passive Heat Sinks................................ 219
10-4 Boxed Processor Motherboard Keepout Zones (1 of 4).......................................... 220
10-5 Boxed Processor Motherboard Keepout Zones (2 of 4).......................................... 221
10-6 Boxed Processor Motherboard Keepout Zones (3 of 4).......................................... 222
10-7 Boxed Processor Motherboard Keepout Zones (4 of 4).......................................... 223
10-8 Boxed Processor Heat Sink Volumetric (1 of 2).................................................... 224
10-9 Boxed Processor Heat Sink Volumetric (2 of 2).................................................... 225
10-10 4-Pin Fan Cable Connector (For Active Heat Sink)................................................ 226
10-11 4-Pin Base Baseboard Fan Header (For Active Heat Sink)...................................... 227
10-12 Fan Cable Connector Pin Out For 4-Pin Active Thermal Solution ............................. 229
Tables
1-1 HCC, MCC, and LCC SKU Table Summary ............................................................. 11
1-2 Volume Structure and Scope............................................................................... 12