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Term Description
MLC Mid-Level Cache
MSI Message Signaled Interrupt
MSL Moisture Sensitive Labeling
MSR Model Specific Registers
NCTF
Non-Critical to Function. NCTF locations are typically redundant ground or non-critical
reserved, so the loss of the solder joint continuity at end of life conditions will not
affect the overall product functionality.
ODT On-Die Termination
OLTM Open Loop Thermal Management
PCG
Platform Compatibility Guide (PCG) (previously known as FMB) provides a design
target for meeting all planned processor frequency requirements.
PCH
Platform Controller Hub. The chipset with centralized platform capabilities including
the main I/O interfaces along with display connectivity, audio features, power
management, manageability, security, and storage features.
PECI
The Platform Environment Control Interface (PECI) is a one-wire interface that
provides a communication channel between Intel processor and chipset components
to external monitoring devices.
Ψ
ca
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
CASE
- T
LA
) / Total
Package Power. The heat source should always be specified for Y measurements.
PEG
PCI Express* Graphics. External Graphics using PCI Express* Architecture. It is a
high-speed serial interface where configuration is software compatible with the
existing PCI specifications.
PL1, PL2 Power Limit 1 and Power Limit 2
PPD Pre-charge Power-down
Processor The 64-bit multi-core component (package)
Processor Core
The term “processor core” refers to Si die itself, which can contain multiple execution
cores. Each execution core has an instruction cache, data cache, and 256-KB L2
cache. All execution cores share the L3 cache.
Processor Graphics Intel Processor Graphics
Rank
A unit of DRAM corresponding to four to eight devices in parallel, ignoring ECC. These
devices are usually, but not always, mounted on a single side of a SO-DIMM.
SCI System Control Interrupt. SCI is used in the ACPI protocol.
SF Strips and Fans
SMM System Management Mode
SMX Safer Mode Extensions
Storage Conditions
A non-operational state. The processor may be installed in a platform, in a tray, or
loose. Processors may be sealed in packaging or exposed to free air. Under these
conditions, processor landings should not be connected to any supply voltages, have
any I/Os biased, or receive any clocks. Upon exposure to “free air” (that is, unsealed
packaging or a device removed from packaging material), the processor must be
handled in accordance with moisture sensitivity labeling (MSL) as indicated on the
packaging material.
SVID Serial Voltage Identification
TAC Thermal Averaging Constant
continued...
Introduction—Processor
Desktop 4th Generation Intel
®
Core
™
Processor Family, Desktop Intel
®
Pentium
®
Processor Family, and Desktop Intel
®
Celeron
®
Processor Family
December 2013 Datasheet – Volume 1 of 2
Order No.: 328897-004 15