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Boxed Processor Specifications
244 Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
The STS200C utilizes a fan capable of 4-pin pulse width modulated (PWM) control. Use
of a 4-pin PWM controlled active thermal solution helps customers meet acoustic
targets in pedestal platforms through the baseboard’s ability to directly control the RPM
of the processor heat sink fan. See Section 10.3 for more details on fan speed control.
Also see Section 2.5, “Platform Environment Control Interface (PECI)” for more on the
PWM and PECI interface along with Digital Thermal Sensors (DTS).
10.1.3 Intel Thermal Solution STS200P and STS200PNRW
(Boxed 25.5 mm Tall Passive Heat Sink Solutions)
The STS200P and STS200PNRW are available for use with boxed processors that have
TDP’s of 130W and lower. These 25.5 mm Tall passive solutions are designed to be used
in SSI Blades, 1U, and 2U chassis where ducting is present. The use of a 25.5 mm Tall
heatsink in a 2U chassis is recommended to achieve a lower heatsink T
LA
and more
flexibility in system design optimization. Figure 10-3 is a representation of the heat
Figure 10-1. STS200C Passive/Active Combination Heat Sink (with Removable Fan)
Figure 10-2. STS200C Passive/Active Combination Heat Sink (with Fan Removed)