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4 Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families
Datasheet Volume One
3.2.4 Execute Disable Bit .................................................................................83
3.3 Intel® Hyper-Threading Technology.....................................................................83
3.4 Intel® Turbo Boost Technology ...........................................................................83
3.4.1 Intel® Turbo Boost Operating Frequency ...................................................83
3.5 Enhanced Intel SpeedStep® Technology...............................................................84
3.6 Intel® Intelligent Power Technology.....................................................................84
3.7 Intel® Advanced Vector Extensions (Intel® AVX) ..................................................84
3.8 Intel Dynamic Power Technology .........................................................................85
4 Power Management .................................................................................................87
4.1 ACPI States Supported .......................................................................................87
4.1.1 System States........................................................................................87
4.1.2 Processor Package and Core States ...........................................................87
4.1.3 Integrated Memory Controller States.........................................................88
4.1.4 DMI2/PCI Express* Link States.................................................................89
4.1.5 Intel QuickPath Interconnect States ..........................................................89
4.1.6 G, S, and C State Combinations................................................................90
4.2 Processor Core/Package Power Management .........................................................90
4.2.1 Enhanced Intel SpeedStep Technology.......................................................90
4.2.2 Low-Power Idle States.............................................................................91
4.2.3 Requesting Low-Power Idle States ............................................................92
4.2.4 Core C-states.........................................................................................92
4.2.5 Package C-States ...................................................................................94
4.2.6 Package C-State Power Specifications........................................................97
4.3 System Memory Power Management ....................................................................98
4.3.1 CKE Power-Down....................................................................................98
4.3.2 Self Refresh ...........................................................................................98
4.3.3 DRAM I/O Power Management..................................................................99
4.4 DMI2/PCI Express* Power Management................................................................99
5 Thermal Management Specifications ......................................................................101
5.1 Package Thermal Specifications .........................................................................101
5.1.1 Thermal Specifications...........................................................................101
5.1.2 TCASE and DTS Based Thermal Specifications...........................................103
5.1.3 Processor Thermal Profiles .....................................................................104
5.1.4 Embedded Server Processor Thermal Profiles............................................130
5.1.5 Thermal Metrology................................................................................133
5.2 Processor Core Thermal Features.......................................................................135
5.2.1 Processor Temperature..........................................................................135
5.2.2 Adaptive Thermal Monitor ......................................................................135
5.2.3 On-Demand Mode.................................................................................137
5.2.4 PROCHOT_N Signal...............................................................................137
5.2.5 THERMTRIP_N Signal ............................................................................138
5.2.6 Integrated Memory Controller (IMC) Thermal Features...............................138
6 Signal Descriptions ................................................................................................141
6.1 System Memory Interface Signals ......................................................................141
6.2 PCI Express* Based Interface Signals .................................................................142
6.3 DMI2/PCI Express* Port 0 Signals......................................................................144
6.4 Intel QuickPath Interconnect Signals ..................................................................144
6.5 PECI Signal.....................................................................................................145
6.6 System Reference Clock Signals ........................................................................145
6.7 JTAG and TAP Signals.......................................................................................145
6.8 Serial VID Interface (SVID) Signals....................................................................146
6.9 Processor Asynchronous Sideband and Miscellaneous Signals.................................146
6.10 Processor Power and Ground Supplies ................................................................149