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2.6 - Thermal Interface Material
There are two types of
thermal interface materials
designed for use with the
AMD
®
Opteron
™
processors.
The most common material
comes as a small pad
attached to the heat sink at
the time of purchase. There
should be a protective cover
over the material. Take care
not to touch this material.
Simply remove the protective
cover and place the heat
sink on the processor.
The second type of interface
material is usually packaged
separately. It is commonly
referred to as ‘thermal
compound’. Simply apply a
thin layer on to the CPU lid
(applying too much will
actually reduce the cooling).
NOTE
Always check with the manufacturer of the heat sink &
processor to ensure the Thermal Interface material is
compatible with the processor & meets the manufacturer’s
warranty requirements
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