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NOTE: Retrofitting a system in the field with a UPS and ERMs will likely require moving all
installed enclosures in the rack to provide space for the new hardware. One or more of the
enclosures that formerly resided in the rack might be displaced and therefore have to be installed
in another rack that would also need a UPS and ERMs installed. Additionally, lifting equipment
might be required to lift heavy enclosures to their new location.
For information and specifications on the R12000/3 UPS, see Chapter 3 (page 37) and refer to
the HP 3 Phase UPS User Guide. This guide is available at:
http://bizsupport.austin.hp.com/bc/docs/support/SupportManual/c01079392/c01079392.pdf
If you install a UPS other than the HP model R12000/3 UPS in each modular cabinet of a NonStop
BladeSystem, these requirements must be met to insure the system can survive a total AC power
fail:
• The UPS output voltage can support the HP PDU input voltage requirements.
• The UPS phase output matches the PDU phase input. For NonStop BladeSystems, 3-phase
output UPSs and 3-phase input HP PDUs are supported. For details, refer to Chapter 3
(page 37).
• The UPS output can support the targeted system in the event of an AC power failure.
Calculate each cabinet load to insure the UPS can support a proper ride-through time in the
event of a total AC power failure. For more information, refer to “Enclosure Power Loads”
(page 46).
NOTE: A UPS other than the HP model R12000/3 UPS will not be able to utilize the power
fail support of the Configure a Power Source as UPS OSM action.
If your applications require a UPS that supports the entire system or even a UPS or motor
generator for all computer and support equipment in the site, you must plan the site’s electrical
infrastructure accordingly.
Cooling and Humidity Control
Do not rely on an intuitive approach to design cooling or to simply achieve an energy
balance—that is, summing up to the total power dissipation from all the hardware and sizing a
comparable air conditioning capacity. Today’s high-performance NonStop BladeSystems use
semiconductors that integrate multiple functions on a single chip with very high power densities.
These chips, plus high-power-density mass storage and power supplies, are mounted in ultra-thin
system and storage enclosures, and then deployed into computer racks in large numbers. This
higher concentration of devices results in localized heat, which increases the potential for hot
spots that can damage the equipment.
Additionally, variables in the installation site layout can adversely affect air flows and create hot
spots by allowing hot and cool air streams to mix. Studies have shown that above 70°F (20°C),
every increase of 18°F (10°C) reduces long-term electronics reliability by 50%.
Cooling airflow through each enclosure in the NonStop BladeSystem is front-to-back. Because
of high heat densities and hot spots, an accurate assessment of air flow around and through the
system equipment and specialized cooling design is essential for reliable system operation. For
an airflow assessment, consult with your HP cooling consultant or your heating, ventilation, and
air conditioning (HVAC) engineer.
Cooling and Humidity Control 33