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EM78P468N/EM78P468L
8-Bit Microcontroller
Product Specification (V1.5) 02.15.2007
• 75
(This specification is subject to change without further notice)
E Quality Assurance and Reliability
Test Category Test Conditions Remarks
Solderability
Solder temperature=245±5°C, for 5 seconds up to the
stopper using a rosin-type flux
–
Step 1: TCT, 65°C (15mins)~150°C (15mins), 10 cycles
Step 2: Bake at 125°C, TD (endurance)=24 hrs
Step 3: Soak at 30°C/60%，TD (endurance)=192 hrs
Pre-condition
Step 4: IR flow 3 cycles
(Pkg thickness ≥ 2.5mm or
Pkg volume ≥ 350mm3 ----225±5°C)
(Pkg thickness ≤ 2.5mm or
Pkg volume ≤ 350mm3 ----240±5°C)
For SMD IC (such as
SOP, QFP, SOJ, etc)
Temperature cycle test -65°C (15mins)~150°C (15mins), 200 cycles –
Pressure cooker test
TA =121°C, RH=100%, pressure=2 atm,
TD (endurance)= 96 hrs
–
High temperature /
High humidity test
TA=85°C , RH=85%，TD (endurance) = 168 , 500 hrs –
High-temperature
storage life
TA=150°C, TD (endurance) = 500, 1000 hrs –
High-temperature
operating life
TA=125°C, VCC = Max. operating voltage,
TD (endurance) = 168, 500, 1000 hrs
–
Latch-up TA=25°C, VCC = Max. operating voltage, 150mA/20V –
ESD (HBM) TA=25°C, ≥∣± 3KV∣
ESD (MM) TA=25°C, ≥ ∣± 300V∣
IP_ND,OP_ND,IO_ND
IP_NS,OP_NS,IO_NS
IP_PD,OP_PD,IO_PD
IP_PS,OP_PS,IO_PS
VDD-VSS(+),VDD_VSS
(-) Mode
E.1 Address Trap Detect
An address trap detect is one of the MCU embedded fail-safe functions that detects
MCU malfunction caused by noise or the like. Whenever the MCU attempts to fetch an
instruction from a certain section of ROM, an internal recovery circuit is auto started. If
a noise-caused address error is detected, the MCU will repeat execution of the
program until the noise is eliminated. The MCU will then continue to execute the next
program.