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Intel
®
6321ESB ICH—Packaging Technology
Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
TMDG February 2007
10
Notes:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.
3. Package Mechanical Requirements
The Intel® 6321ESB I/O Controller Hub package has an exposed bare die which is
capable of sustaining a maximum static normal load of 15-lbf. The package is NOT
capable of sustaining a dynamic or static compressive load applied to any edge of the
bare die. These mechanical load limits must not be exceeded during heatsink
installation, mechanical stress testing, standard shipping conditions and/or any other
use condition.
Notes:
1. The heatsink attach solutions must not include continuous stress onto the chipset package with the
exception of a uniform load to maintain the heatsink-to-package thermal interface.
2. These specifications apply to uniform compressive loading in a direction perpendicular to the bare die/
IHS top surface.
3. These specifications are based on limited testing for design characterization. Loading limits are for the
package only.
Figure 4. Intel® 6321ESB I/O Controller Hub Package Dimensions (Bottom View)
40 + 0.05
A
B
40 + 0.05
C
A
0.2
- A -
35X
1.092
19.11
2822 26242018161412108642 36343230
11 2523211917151397531 2729 333531
A
H
AF
A
D
AB
Y
V
T
P
M
K
H
F
D
AK
AM
AP
AT
B
A
AJ
AE
A
C
AA
U
R
N
L
J
G
E
C
W
AG
AL
A
N
A
R
19.11
35X 1.092