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Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
February 2007 TMDG
7
Introduction—Intel
®
6321ESB ICH
1.2 Definition of Terms
1.3 Reference Documents
The reader of this specification should also be familiar with material and concepts
presented in the following documents:
Table 1. Definition of Terms
Term Definition
BLT
Bond line thickness. Final settled thickness of the
thermal interface material after installation of
heatsink.
FCBGA
Flip Chip Ball Grid Array. A ball grid array packaging
technology where the die is exposed on the package
substrate.
Intel® 6321ESB I/O Controller Hub
The chipset component that integrates an Ultra ATA
100 controller, six Serial ATA host controller ports,
one EHCI host controller supporting eight external
USB 2.0 ports, LPC interface controller, flash BIOS
interface controller, PCI/PCI-X interface controller,
PCI Express interface, BMC controller, Azalia / AC'97
digital controller, integrated LAN controller, an ASF
controller and a ESI for communication with the MCH.
LFM
Linear Feet Per Minute. A measure of airflow emitted
from a forced convection device, such as an axial fan
or blower.
MCH
Memory controller hub. The chipset component that
contains the processor interface, the memory
interface, and the South Bridge Interface.
Tcase-max
Maximum die temperature allowed. This temperature
is measured at the geometric center of the top of the
package die.
Tcase-min
Minimum die temperature allowed. This temperature
is measured at the geometric center of the top of the
package die.
TDP
Thermal Design Power. Thermal solutions should be
designed to dissipate this target power level. TDP is
not the maximum power that the chipset can
dissipate.
Ψ
CA
Case-to-ambient thermal characterization parameter.
A measure of the thermal solution thermal
performance including the TIM using total package
power. Defined as (TCASE – TLA) / Total Package
Power.
Note: Heat source must be specified when using Ψ
calculations.
Ψ
CS
Case-to-Sink thermal characterization parameter. A
measure of the thermal interface material
performance using total package power. Defined as
(TCASE - TSINK)/ Total Package Power.
Note: Heat source must be specified when using Ψ
calculations.
Ψ
SA
Sink-to-Ambient thermal characterization parameter.
A measure of the heat sink performance using total
package power. Defined as (TSINK - TLA)/Total
Package Power.
Note: Heat source must be specified when using Ψ
calculations.