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Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
February 2007 TMDG
19
Reference Thermal Solution—Intel
®
6321ESB ICH
7.0 Reference Thermal Solution
Intel has developed one reference thermal solution to meet the cooling needs of the
Intel® 6321ESB I/O Controller Hub component under operating environments and
specifications defined in this document. This chapter describes the overall requirements
for the Torsional Clip Heatsink reference thermal solution including critical-to-function
dimensions, operating environment, and validation criteria. Other chipset components
may or may not need attached thermal solutions, depending on your specific system
local-ambient operating conditions.
7.1 Operating Environment
The Intel
®
6321ESB ICH reference thermal solution was designed assuming a
maximum local-ambient temperature of 65°C. The minimum recommended airflow
velocity through the cross section of the heatsink fins is 150 linear feet per minute
(LFM). The approaching airflow temperature is assumed to be equal to the local-
ambient temperature. The thermal designer must carefully select the location to
measure airflow to obtain an accurate estimate. These local-ambient conditions are
based on a 55°C external-ambient temperature at sea level. (External-ambient refers
to the environment external to the system.)
7.2 Heatsink Performance
Figure 9 depicts the measured thermal performance of the reference thermal solution
versus approach air velocity. Since this data was measured at sea level, a correction
factor would be required to estimate thermal performance at other altitudes.