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Intel
®
6321ESB ICH—Reference Thermal Solution
Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
TMDG February 2007
24
7.5.2 Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
7.5.3 Thermal Interface Material
A Thermal Interface Material (TIM) provides improved conductivity between the die and
heatsink. The reference thermal solution uses Honeywell* PCM45F, 0.254 mm (0.010
in.) thick, 15 mm x 15 mm (0.59 in. x 0.59 in.) square.
Note: Unflowed or "dry" Honewell PCM-45F has a material thickness of 0.010 inch. The
flowed or "wet" Honeywell PCM-45F has a material thickness of ~0.003 inch after it
reaches its phase change temperature.
7.5.3.1 Effect of Pressure on TIM Performance
As mechanical pressure increases on the TIM, the thermal resistance of the TIM
decreases. This phenomenon is due to the decrease of the bond line thickness (BLT).
BLT is the final settled thickness of the thermal interface material after installation of
heatsink. The effect of pressure on the thermal resistance of the Honeywell PCM45 F
TIM is shown in Table 5.
Intel provides both End of Line and End of Life TIM thermal resistance values of
Honeywell PCM45F. End of Line and End of Life TIM thermal resistance values are
obtained through measurement on a Test Vehicle similar to the Intel® 631xESB/
632xESB I/O's physical attributes using an extruded aluminum heatsink. The End of
Line value represents the TIM performance post heatsink assembly while the End of
Figure 12. Torsional Clip Heatsink Assembly