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Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
February 2007 TMDG
5
Introduction—Intel
®
6321ESB ICH
1.0 Introduction
As the complexity of computer systems increases, so do the power dissipation
requirements. Care must be taken to ensure that the additional power is properly
dissipated. Typical methods to improve heat dissipation include selective use of
ducting, and/or passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the
Intel® 6321ESB I/O Controller Hub.
• Describe a reference thermal solution that meets the specification of Intel®
6321ESB I/O Controller Hub in Embedded applications.
Properly designed thermal solutions provide adequate cooling to maintain the Intel®
6321ESB I/O Controller Hub component die temperatures at or below thermal
specifications. This is accomplished by providing a low local-ambient temperature,
ensuring adequate local airflow, and minimizing the die to local-ambient thermal
resistance. By maintaining the Intel® 6321ESB I/O Controller Hub component die
temperature at or below the specified limits, a system designer can ensure the proper
functionality, performance, and reliability of the chipset. Operation outside the
functional limits can degrade system performance and may cause permanent changes
in the operating characteristics of the component.
The simplest and most cost-effective method to improve the inherent system cooling
characteristics is through careful chassis design and placement of fans, vents, and
ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or
heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the Intel® 6321ESB I/O
Controller Hub component only. For thermal design information on other chipset
components, refer to the respective component datasheet.
1.1 Design Flow
To develop a reliable, cost-effective thermal solution, several tools have been provided
to the system designer. Figure 1 illustrates the design process implicit to this document
and the tools appropriate for each step.