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Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
February 2007 TMDG
21
Reference Thermal Solution—Intel
®
6321ESB ICH
7.4 Board-Level Components Keepout Dimensions
The location of holes pattern and keepout zones for the reference thermal solution are
shown in Figure 11. This reference thermal solution has the same mounting hole
pattern as that of the Intel® E7500/E7501/E7505 chipset.
Figure 10. Torsional Clip Heatsink Volumetric Envelope for the Intel® 6321ESB I/O
Controller Hub
21.33mm
4.30mm
TNB
Heatsink
42.3
0m
m
.
42.30 mm.
ESB2
Passive
Heatsink
Die + TIM
FCBGA + Solder Balls
33.30 mm.
Motherboard
ESB2
Passive
Heatsink
4.30 mm.
21.33mm
4.30mm
21.33 mm
2.61 mm
42.30 mm
42.30 mm
21.33mm
4.30mm
TNB
Heatsink
42.3
0m
m
.
42.30 mm.
Passive
Heatsink
Die + TIM
FCBGA + Solder Balls
33.30 mm.
Motherboard
Passive
Heatsink
4.30 mm.
21.33mm
4.30mm
21.33 mm
2.61 mm
42.30 mm
42.30 mm
21.33mm
4.30mm
TNB
Heatsink
42.3
0m
m
.
42.30 mm.
ESB2
Passive
Heatsink
Die + TIM
FCBGA + Solder Balls
33.30 mm.
Motherboard
ESB2
Passive
Heatsink
4.30 mm.
21.33mm
4.30mm
21.33 mm
2.61 mm
42.30 mm
42.30 mm
21.33mm
4.30mm
TNB
Heatsink
42.3
0m
m
.
42.30 mm.
Passive
Heatsink
Die + TIM
FCBGA + Solder Balls
33.30 mm.
Motherboard
Passive
Heatsink
4.30 mm.
21.33mm21.33mm
4.30mm
TNB
Heatsink
42.3
0m
m
.
42.30 mm.
ESB2
Passive
Heatsink
Die + TIM
FCBGA + Solder Balls
33.30 mm.
Motherboard
ESB2
Passive
Heatsink
4.30 mm.
21.33mm
4.30mm
21.33 mm
2.61 mm
42.30 mm
42.30 mm
21.33mm
4.30mm
TNB
Heatsink
42.3
0m
m
.
42.30 mm.
Passive
Heatsink
Die + TIM
FCBGA + Solder Balls
33.30 mm.
Motherboard
Passive
Heatsink
4.30 mm.
21.33mm
4.30mm
21.33 mm
2.61 mm
42.30 mm
42.30 mm