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Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
February 2007 TMDG
25
Reference Thermal Solution—Intel
®
6321ESB ICH
Life value is the predicted TIM performance when the product and TIM reaches the end
of its life. The heatsink clip provides enough pressure for the TIM to achieve End of Line
thermal resistance of 0.345 °C x in
2
/W and End of Life thermal resistance of 0.459°C
in
2
/W.
7.5.4 Heatsink Clip
The reference solution uses a wire clip with hooked ends. The hooks attach to wire
anchors to fasten the clip to the board. See Appendix B, “Mechanical Drawings” for a
mechanical drawing of the clip.
7.5.5 Clip Retention Anchors
For Intel® 6321ESB I/O Controller Hub-based platforms that have very limited board
space, a clip retention anchor has been developed to minimize the impact of clip
retention on the board. It is based on a standard three-pin jumper and is soldered to
the board like any common through-hole header. A new anchor design is available with
45° bent leads to increase the anchor attach reliability over time. See Appendix A,
“Thermal Solution Component Suppliers” for the part number and supplier information.
Table 5. Honeywell PCM45 F TIM Performance as a Function of Attach Pressure
Pressure on IHS(psi)
Thermal Resistance (°C × in
2
)/W
End of Line End of Life End of Line End of Life
2.18 0.391 0.551
4.35 0.345 0.459
Note: All measured at 50ºC.