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Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
February 2007 TMDG
3
Contents—Intel
®
6321ESB ICH
Contents
1.0 Introduction..............................................................................................................5
1.1 Design Flow........................................................................................................5
1.2 Definition of Terms..............................................................................................7
1.3 Reference Documents ..........................................................................................7
2.0 Packaging Technology ...............................................................................................9
3.0 Thermal Specifications ............................................................................................11
3.1 Thermal Design Power (TDP) .............................................................................. 11
3.2 Die Case Temperature .......................................................................................11
4.0 Thermal Simulation .................................................................................................12
5.0 Thermal Solution Requirements............................................................................... 13
5.1 Characterizing the Thermal Solution Requirement..................................................13
6.0 Thermal Metrology ..................................................................................................16
6.1 Die Case Temperature Measurements .................................................................. 16
6.1.1 Zero Degree Angle Attach Methodology..................................................... 16
7.0 Reference Thermal Solution.....................................................................................19
7.1 Operating Environment ...................................................................................... 19
7.2 Heatsink Performance........................................................................................ 19
7.3 Mechanical Design Envelope ............................................................................... 20
7.4 Board-Level Components Keepout Dimensions ......................................................21
7.5 Torsional Clip Heatsink Thermal Solution Assembly ................................................22
7.5.1 Heatsink Orientation............................................................................... 23
7.5.2 Mechanical Interface Material................................................................... 24
7.5.3 Thermal Interface Material....................................................................... 24
7.5.4 Heatsink Clip .........................................................................................25
7.5.5 Clip Retention Anchors............................................................................25
8.0 Reliability Guidelines...............................................................................................26
A Thermal Solution Component Suppliers ...................................................................27
A.1 Torsional Clip Heatsink Thermal Solution ..............................................................27
B Mechanical Drawings...............................................................................................28
Figures
1 Thermal Design Process ..............................................................................................6
2 Intel® 6321ESB I/O Controller Hub Package Dimensions (Top View).................................9
3 Intel® 6321ESB I/O Controller Hub Package Dimensions (Side View)................................9
4 Intel® 6321ESB I/O Controller Hub Package Dimensions (Bottom View)..........................10
5 Processor Thermal Characterization Parameter Relationships .........................................14
6 Thermal Solution Decision Flowchart........................................................................... 17
7 Zero Degree Angle Attach Heatsink Modifications .........................................................17
8 Zero Degree Angle Attach Methodology (Top View)....................................................... 18
9 Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity and Target
at 65C Local-Ambient ...............................................................................................20
10 Torsional Clip Heatsink Volumetric Envelope for the Intel® 6321ESB I/O Controller Hub .... 21
11 Torsional Clip Heatsink Board Component Keepout .......................................................23
12 Torsional Clip Heatsink Assembly ...............................................................................24
13 Torsional Clip Heatsink Assembly Drawing...................................................................29
14 Torsional Clip Heatsink Drawing................................................................................. 30