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Chip resistor
15
15. PCB
mounting
2. SMD type
To meet the market demand for downsizing to smaller, lighter, and thinner products, PC boards also need to proceed from
insertion mounting to surface mounting technology.
To meet this need, we offer a line of surface mount relays. The following describes some cautions required for surface
mount relay installation to prevent malfunction and incorrect operation.
*Please contact us for or reflow soldering of through-hole terminal type.
1. What is a Surface Mount Relay?
1. From IMT to SMT
Conventional insertion mount technology (IMT) with some 30 years of history is now being replaced with surface mount
technology (SMT).
Solid-state components such as resistors, ICs, and diodes can withstand high heat stresses from reflow soldering because
they use no mechanical parts. In contrast, the conventional electro-mechanical relays consisting of solenoid coils, springs,
and armatures are very sensitive to thermal stress from reflow soldering.
We applied the experience gained from our advanced relay technologies to produce high-performance electromagnetic
relays compatible with surface mount technologies such as IRS and VPS.
Insertion Mount Technology & Surface Mount Technology
Insertion
Mounting
Technology
(IMT)
Components' terminals are inserted into terminal
holes of PC board and are soldered to copper pads
on the other side of the board. (flow-soldering)
Surface
Mounting
Technology
(SMT)
Components are placed on copper pads pre-coated
with paste solder and the board assembly is heated to
solder the components on the pads. (reflow soldering)
2. Features and Effects
Features Effects
Allows high density mounting
Components can be installed on both sides of a board
Ceramic PC boards can be used
System downsizing
Compatible with automatic placement by robots
Drilling for lead holes is not required
Compact system designs are possible due to high density mounting
Overall cost reduction
High heat resistance
Anti-gas measures
High reliability
The surface mount relay is realized with the following advanced technologies:
• Heat-resistance encapsulation technique
• Gas analysis
• Reliability assessment
• Precision molding technique for heat-resistant materials