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3. Reflow
Reflow soldering under inadequate soldering conditions may result in unreliable
relay performance or even physical damage to the relay (even if the relay is of
surface mount type with high heat resistance).
1.IRS profile
Note: When a soldering technique other than above is to be used (hot air, hotplate,
laser, or pulse heater technique), carefully investigate the suitability of the
technique.
The soldering temperature profile indicates the pad temperature. In some
cases, the ambient temperature may be greatly increased. Examine it under
the specific mounting condition.
2.Manual soldering
Soldering iron tip temperature: 350°C (662°F)
Soldering iron wattage: 30 to 60 W
Soldering time: Less than 3 sec.
3.Others
For other solder methods except for the above (such as hot air heating, hot plate
heating, laser heating, pulse heating, etc.), please check for mounting and soldering
condition before use.
• It is recommended that the soldered pad be immediately cooled to prevent thermal
damage to the relay and its associated components.
• While surface mount relays are solvent washable, do not immerse the relay in cold
cleaning solvent immediately after soldering.
4. Cooling / Cleaning
• While sealed-type (plastic-sealed) relays are solvent washable, do not immerse
the relay in cold cleaning solvent immediately after soldering.
• Use alcohol or an equivalent solvent for cleaning.
• Boiled cleaning is approved for surface mount relays. Ultrasonic cleaning may
cause coil damage or light contact sticking.