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Chapter 2 Processor Thermal Solutions 13
Thermal Design Guide for Socket F (1207) Processors
32800 Rev. 3.00 August 2006
Chapter 2 Processor Thermal Solutions
This chapter describes the thermal solutions for systems based on socket F (1207) processors.
2.1 Processor Specifications
The objective of thermal solutions is to maintain the processor temperature within specified limits.
Thermal performance, physical mounting, acoustic noise, mass, reliability, and cost must be
considered during the design of a thermal solution.
Table 1 lists the pertinent processor specifications for a thermal solution design for systems based on
socket F (1207) processors.
Table 1. Mechanical and Thermal Specifications for Socket F (1207) Processors
Symbol Description
Maximum
Value
Notes
T
Case
Maximum case
temperature
67°C - 72°C Consult the processor data sheet for the
thermal requirements specific to the
processor.
A
CPU
Processor contact
area
32.5 mm x
32.5 mm
Interfaces with heat sink
Form
Factor
Processor form
factor
LGA LGA form factor for socket F (1207)
processors