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24 Thermal Design of Custom 1U-2P Systems Chapter 4
32800 Rev. 3.02 August 2006
Thermal Design Guide for Socket F (1207) Processors
Figure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems
The following sections describe the mechanical requirements of the components shown in Figure 5.
4.3.1 Backplate Assembly
For details on the backplate assembly, see section 3.3.1 on page 18.
Note: The backplate for this custom design has a mounting-hole pitch of 4.1 inches.
4.3.2 Spring Screws
The spring screws are designed to apply 75 lbs of force to the heat sink. This force is necessary to
help prevent the heat sink from lifting off the package during shock- or vibration-induced events.