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Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal
Solution for Socket F (1207) Processors
39
Thermal Design Guide for Socket F (1207) Processors
32800 Rev. 3.00 August 2006
Figure 13. Socket F (1207) PIB Mounting Holes, Contact Pads, and No-Routing Zone
x2054.0
0.0000.00
x223.52
24.11
1.44136.59
0.787
0.39 7 2x10.09
49.91
2x19.99
1.96 5 2x
2.35 5 2x
2.53464.36
0.96624.54
3.00876.41
000.0
36.61
00.0
59.81
x2556.0
321.0
x2075.178.93
73.35
x231.3
x2101.2
799.0
x273.81327.0
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weiVenoZgnituoR
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.secartreyalretuooN;thgiehtnenopmocxaM]''000.0[00.0
.thgie
htnenopmocxaM]''000.0[00.0
D
C
B
A
A
B
C
D
1
23
4
5
6
78
8
7
56 4
3
2
1
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SAXET,NITSUA
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VER
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4210000Z97
1.2
x4CLIATED
1:2ELACS
elohgnitnuomdetalp-noN
232.009.5
643.008.8
x2ALIATED
1:2ELACS
elohgnitnuomdetalp-noN
x352.1940.0
831.0 x305.3
R
711.079.2R
1:2ELACS
x4BLIATED
reppocdetaocredloS
241.006.3
632.000.6
1AniP
B
A
C
x259.6R472.0
tuopeeK
BIPDMAhtiw
tnailpmoCsnoitcirtseRthgieHdna
tnenopmoCrossecorP)7021(FtekcoS