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Chapter 4 Thermal Design of Custom 1U-2P Systems 25
Thermal Design Guide for Socket F (1207) Processors
32800 Rev. 3.02 3.00 August 2006
Lifting the heat sink away from the processor can result in damage to the processor contact pads, the
socket contacts, or the socket solder-ball joints. Maintaining the spring force is important for the life
of the processor and the socket and for repeated installations and upgrades of the processor.
4.3.3 Heat Sink
Figure 6 shows a picture of the reference design heat sink for 1U-2P systems. The footprint of the
heat sink is 87 mm x 74 mm. The heat sink weighs 420 g and has aluminum fins soldered to a copper
base. The copper base tapers from a thickness of 6 mm at the center to 1.5 mm at the edges. This
tapering provides optimum heat-spreading performance from the processor to the heat sink while
keeping the heat sink weight within specification. The fin geometry is designed to provide optimized
thermal performance in combination with the fans, as described in Section 4.3.4, on page 26, in a
typical 1U-2P system.
Figure 6. High Performance Heat Sink for Custom 1U-2P Systems
Table 6 shows the parameters of the aluminum fins for the high-performance heat sink shown in
Figure 6.
Table 6. Fin Parameters
Length
Height (at
Center)
Height (at Edges) Thickness Pitch No. of Fins
87 mm 22 mm 26.5 mm 0.4 mm 1.48
mm
50