4 Contents
32800 Rev. 3.02 August 2006
Thermal Design Guide for Socket F (1207) Processors
5.3.4 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
5.3.5 Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
5.3.6 Thermal Interface Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal Solution for
Socket F (1207) Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Appendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the
Socket F (1207) Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the
Socket F (1207) Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Appendix D Flow Simulation Results for Custom 2U-4P Systems Based on
Socket F (1207) Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61