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Chapter 3 Thermal Design of Platforms Using the AMD Processor-In-a-
Box (PIB) Thermal Solution
17
Thermal Design Guide for Socket F (1207) Processors
32800 Rev. 3.00 August 2006
Table 3 lists the parts used in the thermal reference design for the AMD PIB thermal solution for
socket F (1207) processors.
Figure 3 on page 18 shows an exploded view of the thermal solution for platforms using an AMD PIB
based on socket F (1207) processors.
Table 3. Components for the Processor Thermal Reference Design for the AMD PIB
Thermal Solution
Part Description Material Quantity
Heat sink Copper with aluminum fins 1
Heatpipe Sintered-powder copper 2
Fan Plastic 1
Spring clip SK7 heat treated spring steel 1
Retention frame Lexan, 20% glass-filled 2
Backplate Low-carbon steel, anti-corrosive
finish
1
Insulator Formex GK-17 1